JPH02146475U - - Google Patents
Info
- Publication number
- JPH02146475U JPH02146475U JP5529689U JP5529689U JPH02146475U JP H02146475 U JPH02146475 U JP H02146475U JP 5529689 U JP5529689 U JP 5529689U JP 5529689 U JP5529689 U JP 5529689U JP H02146475 U JPH02146475 U JP H02146475U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- pad portion
- lead wires
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5529689U JPH02146475U (en]) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5529689U JPH02146475U (en]) | 1989-05-16 | 1989-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02146475U true JPH02146475U (en]) | 1990-12-12 |
Family
ID=31578120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5529689U Pending JPH02146475U (en]) | 1989-05-16 | 1989-05-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02146475U (en]) |
-
1989
- 1989-05-16 JP JP5529689U patent/JPH02146475U/ja active Pending